Contract Bidding Open For PROC CARD G3INS_ SOC_ V3 Processor board PROCESSOR- CARD- G3INS_ SOC_ V3, Number of Layers: 20, Thi in SULTANPUR, UTTAR PRADESH
Hindustan Aeronautics Limited (hal) announces a tender for PROC CARD G3INS_ SOC_ V3 Processor board PROCESSOR- CARD- G3INS_ SOC_ V3, Number of Layers: 20, Thicknes , G3INS MOTHER BOARD, Mother Board PCB G3INS-MOTHER- BOARD AIRCRAFTS_ V8, Number of Layers: 14, Thickne in SULTANPUR, UTTAR PRADESH. Quantity: 26. Submission Deadline: 16-09-2025 17:00:00. Last date to apply is approaching fast!
Goods
Qty: 26
Financial
Bid Offer Validity:120 (Days)
Arbitration Clause:No
Mediation Clause:No
Technical
Evaluation Method:Item wise evaluation/
Inspection Required:Yes
Technical Clarifications Time:5 Days
Timeline
Issue
August 26, 2025 at 4:35 PM
Bid deadline: September 16, 2025 at 5:00 PM
Bid Opening
16-09-2025 17:30:00
Bid opening: 16-09-2025 17:30:00
Bid Opening Information
Bid Opening Date:16-09-2025 17:30:00
Tender Configuration
Bid Type
Goods
Tender Documents
12 DocumentsDocuments Required from Seller
- Experience Criteria
- Certificate (Requested in ATC)
- OEM Authorization Certificate
- OEM Annual Turnover *In case any bidder is seeking exemption from Experience / Turnover Criteria
- the supporting documents to prove his eligibility for exemption must be uploaded for evaluation by the buyer
Probable Bidders
Companies likely to bid
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